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 - G109 10gram Thermal Conductive Glue, Heatsink Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound for LED GPU MOSFET Printer Chipset IC High Performance
 
By GENNEL
G109 10gram Thermal Conductive Glue, Heatsink Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound for LED GPU MOSFET Printer Chipset IC High Performance
      Regular price
      
        Rs. 709.35
      
    
    
        Regular price
        
          
            
              Rs. 709.35
            
          Sale price
      
        Rs. 709.35
      
    
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About this item
- Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
 - Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
 - It has good thermal conductivity and wide service temperature range(-60~280 degrees Celsius)
 - Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
 - Package Includes : 1 x GENNEL G109 10g thermal glue
 
Description
Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion.
Stable performance, Long-lasting adhesion on both sides, Thermal tape with the Tensile resistance, softness, compression.
Good thermal conductivity and wide service temperature range
Suitable for all heatsink without fixed clip
It has heat conducting properties, strong adhesion.
Suitable for all heatsink without fixed clip. Helps disperse the heat from Chipset to heatsink effectively.
non-volatile, flame-retardant, which eliminates the risk of short circuit and discharges and corrosion damage to the chip and the radiator.
Excellent ease of use and outstanding long-term stability.
Wide working temperature: -60℃ ~ 280℃ (-76℉ to 536℉)
for MOSFET, LED, heat sinks, North-south bridge, graphics card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments..
The curing rateis related to the relative humidity and temperature in the air, the higher the temperature, the faster the curing speed, and vice versa.
Recommended coating thickness: 0.1-0.5mm, the thinner the better.
Please close the lid immediately after use to prevent the glue from curing.
Use for MOSFET, LED, heat sinks , North-south bridge, graphics card , Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
        
          Product Details
| Property | Value | 
|---|---|
| asin | B072MSXHJD | 
| manufacturer | GENNEL | 
| best sellers rank | #3 in Electrically Conductive Adhesives | 
| item model number | GENNEL G109 | 
| product dimensions | 3.54 x 2.76 x 0.63 inches; 0.35 ounces | 
| date first available | June 8, 2018 | 
| is discontinued by manufacturer | No | 
        Brand:
        GENNEL
      
      Regular price
      
        Rs. 709.35
      
    
    
        Regular price
        
          
            
              Rs. 709.35
            
          Sale price
      
        Rs. 709.35
      
    
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